The Memory Module is DDR2-533/667/800 CL5 Small Outline in the density range between 512MB to 2GB consists ofDDR2 667MHz Synchronous DRAMs in FBGA packages. Memory Module is intended for mounting into 200-pin edge connector sockets.


  • JEDEC Standard
  • DDR2 Speed Grade : 533/667/800Mbps
  • SO-DIMM : 200-pin
  • Memory Organization : x8 , x16 FBGA DRAM chip
  • DDR2 DRAM interface : SSTL_18
  • CAS latency : 4-4-4
  • Bandwidth : 4200/5300/6400MB/s
  • VDD voltage : 1.8+-0.1V
  • VDDQ voltage : 1.8+-0.1V
  • Serial presence detect with EEPROM
  • Application : NoteBook
  • Serial presence detect (SPD)with EEPROM

SKU: 005.


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